Infineon & Hon Hai Technology Group signed MoU focusing on SiC & EV development

Today Infineon & Hon Hai Technology Group signed MoU focusing on SiC(silicon Carbide) & EV development, to leverage automotive Sic innovations.


  • Infineon partnership with Hon Hai Technology Group (Foxconn) to understand Sic Product offering, Foxconn’s capability in system-level integration, aso electronic design, and Manufacturing expertise.
  • Also, this system application center is established in Taiwan, plan to expand the scope of their cooperation.
  • This is a long-term partnership in the EV sector to jointly build many advanced electromobility with efficient and smart features…
  • The main focus of the MoU is to leverage Infineon’s automotive Sic innovations And Foxconn’s know-how in automotive systems.

Infineon & Hon Hai Technology Group signed MoU focusing on SiC & EV development

Today largest manufacturer of automotive semiconductors, Infineon, and Hon Hai Technology Group, the global leading provider and manufacturer of electronics service providers signed an MoU With Infineon to focus on SiC & EV development.

Peter Schiefer, President of the Infineon Automotive Division commented, “The automotive industry is evolving. With the rapid growth of the EV market and the associated need for more range and performance, the development of electromobility must continue to advance and innovate,”

Also said: “Infineon’s commitment and passion for innovation and zero-defect quality have made us the best partner for our customers. We look forward to writing a new chapter in electromobility together with Foxconn.”

“We are pleased to be working with Infineon and are confident that this collaboration will result in optimized architecture, product performance, cost competitiveness, and high system integration to provide customers with the most competitive automotive solutions,” said Jun Seki, Foxconn’s Chief Strategy Officer for EVs

As I previously told you that both companies signed Mou to implement the SiC technology in automotive high power applications:

  • traction inverters
  • onboard chargers
  • DC-DC converters

Both companies plan to develop EV solutions with next-level performance and efficiency build on Infneon automotive system.

Both companies plan to set up a system application center in Taiwan the plan to expand their cooperation, this center can optimize vehicle applications also do smart cabin applications, advanced driver assistance systems, and also optimize autonomous driving applications.

It also, aim to optimize the battery management system and traction inverters, also this partnership covers all the Infineon products including sensors, microcontroller, power semiconductors, and high-performance memories for a specific application, a human-machine interface like UI, and security aspects also.

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