Infineon & Hon Hai Technology Group signed MoU

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Today Infineon & Hon Hai Technology Group signed MoU focusing on SiC(silicon Carbide) & EV development, to leverage automotive Sic innovations. 

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Both tie-up to understand Sic Product offering, Foxconn’s capability in system-level integration

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– Also, this system application center is established in Taiwan, plan to expand the scope of their cooperation.

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– This is a long-term partnership in the EV sector to jointly build many advanced electromobility with efficient and smart features…

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– The main focus of the MoU is to leverage Infineon’s automotive Sic innovations And Foxconn’s know-how in automotive systems. More... here

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